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US 8,896,113 B2Granted
Base plate and semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorEitaro Miyake
Life of this patent
Estimating the term…
Abstract
According to one embodiment, the base plate includes first and a second faces that are opposed to each other; the second face has a contoured rear surface, and the first area is set in the center of the plate. There is a second area with via holes in the peripheral areas of the center part. Also, the thickness of the second area is less than the thickness of the first area.
Claims15
A base plate comprising:
- a first area with a first face and a second face that are opposed to each other, in which the second face has a convex surface over a span of the entire second face, the first area provided in a center of the plate;
- and
- a second area, having holes extending therethrough, at a periphery of the first area, wherein
- a thickness of the second area is less than a thickness of the first area.
1 more element
A base plate comprising:
- a first area with a first face and a second face that are opposed to each other, in which the second face has a convex surface, the first area provided in the center of the plate;
- and
- a second area, having holes extending therethrough, at a periphery of the first area, wherein
- at least one aperture is formed through the second area, and
- the second area is made of a first material and a second material surrounding the aperture, the second material having a hardness that is greater than that of the first material and the second area having a thickness that is less than that of the first area.
2 more elements
A mounting assembly comprising:
- a base plate comprising:
- a first area with a first face and a second face that are opposed to each other, in which the second face has a convex surface over a span of the entire second face and the first area is located in a central area of the plate;
- a second area, provided with a hole therethrough, disposed at a periphery of the first area, wherein
- a thickness of the second area is less than a thickness of the first area;
- and
- a semiconductor device mounted to a first side of the first area of the base plate via a bonding agent.
3 more elements
Dependencies are inferred from the claim text.