Semiconductor device and method for manufacturing the same

A method for manufacturing a semiconductor device, comprising:

• preparing a circuit board;
• preparing a first semiconductor chip;
• preparing a second semiconductor chip having an outer shape smaller than that of the first semiconductor chip and a thickness of 75 μm or less;
• mounting the second semiconductor chip on the circuit board;
• electrically connecting the circuit board and the second semiconductor chip via a first connecting member;
• fixing the first semiconductor chip on the circuit board with an adhesive, while embedding at least a part of the second semiconductor chip in the adhesive;
• electrically connecting the circuit board and the first semiconductor chip via a second connecting member;
• and
• forming a sealing resin layer sealing the first and second semiconductor chips with the first and second connecting members, on the circuit board,
• wherein the adhesive includes a thermosetting resin whose thermal time viscosity at a time that the second semiconductor chip is embedded is in a range equal of 500 to 5000 Pa·s or more,
• wherein the preparing of the first semiconductor chip comprises:
• laminating a layer of the adhesive and a dicing tape in sequence on a rear surface of a semiconductor wafer;
• cutting only a part of a thickness of the semiconductor wafer by using a first blade;
• cutting a thickness of a remaining part of the semiconductor wafer and a whole thickness of the layer of the adhesive by using a second blade whose blade width is narrower than that of the first blade, to form the first semiconductor chip having the layer of the adhesive;
• and
• picking up the first semiconductor chip having the layer of the adhesive from the dicing tape, and
• wherein the thickness of the remaining part of the semiconductor wafer after being cut by the first blade is 85 μm or more.