Paste thermal interface materials
AssigneeIntel Corporation
InventorsWei Hu, Zhizhong Tang, Syadwad Jain, Rajen S. Sidhu
Life of this patent
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Abstract
Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an IC package includes an IC component, a heat spreader, and a paste TIM disposed between the die and the heat spreader. The paste TIM may include particles of a metal material distributed through a matrix material, and may have a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns. Other embodiments may be described and/or claimed.
Claims27
A method of fabricating an integrated circuit (IC) package, the method comprising:
- dispensing a paste thermal interface material (TIM) on a first surface of an IC component;
- placing a heat spreader on the paste TIM;
- compressing the paste TIM between the heat spreader and the IC component;
- and
- curing the paste TIM;
- wherein:
- the paste TIM comprises particles of a metal material distributed through a matrix material and having a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns;
- or
- the paste TIM comprises particles of a first material having a thermal conductivity greater than approximately 80 watts/Kelvin-meter, particles of a metal material;
- and a flux material, and a melting temperature of the paste TIM is between approximately 100 degrees Celsius and approximately 300 degrees Celsius.
An integrated circuit (IC) package, comprising:
- an IC component;
- a heat spreader;
- and
- a paste thermal interface material (TIM) disposed between the IC component and the heat spreader, the paste TIM comprising particles of a metal material distributed through a matrix material and having a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns.
A paste thermal interface material (TIM) comprising:
- particles of a first material having a thermal conductivity greater than approximately 80 watts/Kelvin-meter;
- particles of a metal material;
- and
- a flux material;
- wherein a melting temperature of the paste TIM is between approximately 100 degrees Celsius and approximately 300 degrees Celsius.
A method of manufacturing a paste thermal interface material (TIM), the method comprising:
- providing particles of a first material having a thermal conductivity greater than approximately 80 watts/Kelvin-meter;
- providing particles of a metal material having a different chemical composition than the first material;
- and
- forming the paste TIM by combining the particles of the first material, the particles of the metal material, and a flux material, the paste TIM having a melting temperature between approximately 100 degrees Celsius and approximately 300 degrees Celsius.
Dependencies are inferred from the claim text.