Microelectronic devices and methods for manufacturing microelectronic devices

A microelectronic device, comprising:

• a substrate;
• a radiation curable material positioned in and/or on the substrate, wherein the radiation curable material is at least partially curable by an exposure to radiation in a selected range of frequencies;
• a radiation sensitive component formed in and/or on the substrate and aligned with the radiation curable material, wherein the radiation sensitive component is irreversibly altered by an exposure to radiation in the selected range of frequencies;
• and
• means for at least partially reflecting radiation directed toward the radiation sensitive component, the means for at least partially reflecting radiation being positioned at least proximate the substrate and being configured to at least partially expose the radiation curable material to radiation in the selected range of frequencies.

A microelectronic device, comprising:

• a semiconductor substrate;
• a structure disposed at least proximate the semiconductor substrate, wherein the structure is generally reflective of microwave radiation;
• a radiation sensitive component disposed between the semiconductor substrate and the structure, wherein the radiation sensitive component is rendered defective by an exposure to radiation in a predetermined bandwidth;
• and
• an adhesive disposed in and/or on the semiconductor substrate and aligned with the radiation sensitive component, wherein the adhesive comprises a material that is at least partially curable by an exposure to radiation in the predetermined bandwidth.