Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus

An electronic component comprising:

• a semiconductor substrate including a first face and a second face on a side opposite to the first face, the semiconductor substrate including a through hole provided so as to connect the first face and the second face;
• an integrated circuit formed on the first face of the semiconductor substrate;
• an insulating film formed on a side wall of the through hole;
• a conductive portion formed in the through hole and having an end face on the first face of the semiconductor substrate;
• an external connection terminal formed on the first face of the semiconductor substrate;
• a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal;
• a second electrode formed on the first face of the semiconductor substrate, and electrically connected to the integrated circuit and the end face of the conductive portion;
• an electronic element formed on or above the second face of the semiconductor substrate and electrically connected to the conductive portion;
• and
• a sealing member sealing the electronic element.