Apparatus and methods for reducing impact of high RF loss plating
AssigneeSkyworks Solutions, Inc.
InventorsWeimin Sun, Peter J. Zampardi, Jr., Hongxiao Shao
Life of this patent
Estimating the term…
Abstract
To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.
Claims20
An electronic circuit module configured to reduce signal losses, the module comprising:
- an electronic circuit device including a first lead, a second lead, and an integrated circuit die having an on-die passive component, the electronic circuit device configured to have an output signal and current associated with the output signal when the electronic circuit device is activated;
- and
- a trace configured to conduct the current from the output signal to an output of the electronic circuit module, the trace having a first bonding pad electrically connected to the first lead and a second bonding pad located on the trace between the first bonding pad and the output of the electronic circuit module and electrically connected to the second lead, the electronic circuit device configured such that the on-die passive component electrically connects to the first lead and the output signal electrically connects to the second lead, the current thereby being directed away from the first bonding pad.
An electronic circuit device configured to reduce signal losses, the device comprising:
- an integrated circuit die having an on-die passive component;
- a first lead configured to be electrically connected to a first bonding pad located on a trace;
- and
- a second lead configured to be electrically connected to a second bonding pad on the trace, the electronic circuit device configured to have an output signal and a current associated with the output signal when the electronic circuit device is activated, the trace conducting the current from the output signal to other circuitry associated with the trace, the second bonding pad located between the first bonding pad and the other circuitry, the electronic circuit device configured such that the on-die passive component electrically connects to the first lead and the output signal electrically connects to the second lead, the current thereby being directed away from the first bonding pad.
A method for reducing signal losses in an electronic circuit module, the method comprising:
- fabricating an electronic circuit device including an integrated circuit die having an on-die passive component, the electronic circuit device configured to generate an output signal having an associated current when the electronic circuit device is activated;
- forming a first lead and a second lead on the electronic circuit device;
- forming a trace to conduct the current from the output signal to an output of the electronic circuit module;
- forming a first bonding pad on the trace and a second bonding pad on the trace between the first bonding pad and the output of the electronic circuit module;
- electrically connecting the first lead to the first bonding pad and electrically connecting the second lead to the second bonding pad;
- and
- configuring the electronic circuit device so that the on-die passive component electrically connects to the first lead and the output signal electrically connects to the second lead, the current thereby being directed away from the first bonding pad.
Dependencies are inferred from the claim text.