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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTzu-Wei Chiu, Tzu-Yu Wang, Wei-Cheng Wu, Chun-Yi Liu, Hsien-Pin Hu, Shang-Yun Hou
Estimating the term…
Interposers for semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, an interposer includes a substrate, a contact pad disposed on the substrate, and a first through-via in the substrate coupled to the contact pad. A first fuse is coupled to the first through-via. A second through-via in the substrate is coupled to the contact pad, and a second fuse is coupled to the second through-via.
An interposer, comprising:
An interposer for packaging a semiconductor device, comprising:
A method of manufacturing an interposer for packaging a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Vias, e.g. via plugs: through-vias
Top-view shapes or dispositions, e.g. top-view layouts of the vias: top-view shapes
Adaptable interconnections, e.g. fuses or antifuses: fuses, i.e. interconnections changeable from conductive to non-conductive
Insulating or insulated package substrates; Interposers; Redistribution layers: for connecting multiple chips together
About 5 years 7 months of term left · ends 6 Jun 2032 (estimated)
Semiconductor devices are used in a variety of electronic applications, such as personal computers, cell phones, digital cameras, and other electronic equipment, as examples. The semiconductor industry continues to improve the integration density of various electronic components (e.g., transistors, diodes, resistors, capacitors, etc.) by continual reductions in minimum feature sizes of integrated circuits (ICs), which allow more components to be integrated into a given area. These smaller electronic components also require smaller packages that utilize less area than packages of the past, in some applications.
One type of smaller packaging that has been developed is three-dimensional (3D) ICs, in which two die or ICs are bonded together and electrical connections are formed between the die and contact pads on an interposer. Some 3DICs utilize through-silicon vias to make connections from one side to another side of the interposer.
Fuses are devices that are sometimes formed on semiconductor devices that may be programmed using a laser, by directing a laser beam at the fuse from the top or bottom of the semiconductor device. Fuses may be used to alter ICs by connecting or disconnecting redundant circuits or memory cells, to repair the ICs or increase the number of usable ICs on a wafer, for example.
For a more complete understanding of the present disclosure, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
FIG. 1 shows a cross-sectional view of an interposer including a plurality of fuses coupled to a single contact pad in accordance with an embodiment of the present disclosure;
FIG. 2 is a top view of a conductive segment including a fuse of the interposer shown in FIG. 1;
Corresponding numerals and symbols in the different figures generally refer to corresponding parts unless otherwise indicated. The figures are drawn to clearly illustrate the relevant aspects of the embodiments and are not necessarily drawn to scale.
The making and using of the embodiments of the present disclosure are discussed in detail below. It should be appreciated, however, that the present disclosure provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the disclosure, and do not limit the scope of the disclosure.
Embodiments of the present disclosure are related to packages for semiconductor devices that utilize an interposer as a component, such as 3DICs. Structures and methods of forming interposers that include a plurality of fuses coupled to a single contact or bump of the interposers will be described herein.