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US 8,896,079 B2Granted
Camera module having a light shieldable layer
AssigneeLapis Semiconductor Co., Ltd.
InventorMasahiro Uekawa
Life of this patent
Estimating the term…
Abstract
A camera module has a sensor chip including a sensor unit formed on a main surface around which sides are disposed. A lens chip is fixed to the sensor chip with a spacer unit and includes a lens unit corresponding to the sensor unit. A light shieldable layer covers a first side of the sensor chip and a side of the spacer unit. A first cutting surface includes a second side of the sensor chip and a side of the light shieldable layer on a same plane.
Claims11
A camera module comprising:
- a sensor chip including a sensor unit formed on a main surface of the sensor chip;
- a first side of the sensor chip disposed around the main surface;
- a second side of the sensor chip adjacent to and offset from the first side;
- a lens chip which is fixed to the sensor chip with a spacer unit and includes a lens unit corresponding to the sensor unit;
- a light shieldable layer covering the first side of the sensor chip and a side of the spacer unit;
- and
- a first cutting surface including the second side of the sensor chip and a side of the light shieldable layer on a same plane.
4 more elements
Dependencies are inferred from the claim text.