Integrated circuit and manufacturing method
AssigneeNXP B.V.
InventorsYouri Victorovitch Ponomarev, David Tio Castro, Roel Daamen
Life of this patent
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Abstract
Disclosed is an integrated circuit comprising a substrate including at least one light sensor; an interconnect structure over the substrate; at least one passivation layer over the interconnect structure, said passivation layer including a first area over the at least one light sensor; and a gas sensor such as a moisture sensor at least partially on a further area of the at least one passivation layer, wherein the gas sensor comprises a gas sensitive layer in between a first electrode and a second electrode, the gas sensitive layer further comprising a portion over the first area. A method of manufacturing such an IC is also disclosed.
Claims12
An integrated circuit comprising:
- a substrate including at least one light sensor;
- an interconnect structure over the substrate, the interconnect structure at least partially transparent to light such that light from outside the integrated circuit can reach the at least one light sensor;
- at least one passivation layer over the interconnect structure, said passivation layer including a first area over the at least one light sensor;
- and a gas sensor at least partially on a further area of the at least one passivation layer, wherein the gas sensor comprises a gas sensitive layer in between a first electrode and a second electrode, the gas sensitive layer further comprising a portion over the first area.
Dependencies are inferred from the claim text.