Reducing defects in electronic switching devices
AssigneePlastic Logic Limited
InventorsTimothy Von Werne, Catherine Mary Ramsdale, Henning Sirringhaus
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Abstract
A technique for isolating electrodes on different layers of a multilayer electronic device across an array containing more than 100000 devices on a plastic substrate. The technique comprises depositing a bilayer of a first dielectric layer (6) of a solution-processible polymer dielectric and a layer of parylene (9) to isolate layers of conductor or semiconductor on different levels of the device. The density of defects located in the active area of one of the multilayer electronic devices is typically more than 1 in 100000.
Claims13
An electronic switching device comprising:
- source and drain electrodes,
- a semiconductor structure providing a semiconductor channel between the source and drain electrodes, and
- a gate electrode separated from the semiconductor structure by a gate dielectric structure;
- wherein said gate dielectric structure comprises:
- a first non-conformal solution-processed dielectric layer which comprises pinholes, and is in contact with said semiconductor structure;
- and
- a second conformal dielectric layer between said first dielectric layer and said gate electrode, which second dielectric layer penetrates and coats a surface of the first dielectric layer,
- wherein the electronic switching device is a top-gate device;
- and wherein the second conformal dielectric layer comprises a polymer.
Dependencies are inferred from the claim text.