Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
AssigneeALSTOM Technology Ltd
InventorsRoman Raubo, Marek Furyk, John Schwartzenberg
Life of this patent
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Abstract
The invention concerns a silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly. Said silicon devices/heatsinks stack assembly comprises an arrangement of many silicon devices disks, two adjacent silicon devices disks being separated by a flat heatsink device, each silicon device disk and each heatsink comprising a centering hole on its both faces, a centering pin placed between the adjacent centering holes of a silicon device disk and an adjacent heatsink device. Each heatsink device is pierced with two guide holes, at two opposite ends of this one.
Claims11
An assembly of devices comprising:
- one or more silicon device disks each having parallel opposing faces;
- and
- one or more flat heatsink devices,
- wherein the one or more silicon device disks and one or more flat heatsink devices are alternatingly stacked over one another along an alignment path that passes centrally through the silicon disk devices and normally to the parallel opposing faces such that each silicon device disk is separated from each other silicon device disk by at least one flat heatsink device,
- wherein adjacent silicon device disks and heatsink devices include centering holes for accommodating a centering pins between the adjacent devices, and
- wherein each heatsink device is pierced with two guide holes disposed diametrically opposite and equidistantly from a point of intersection of the alignment path and the pierced heatsink device.
A method to pull apart a faulty silicon device in an assembly of devices having one or more silicon device disks each having parallel opposing faces, and
- one or more flat heatsink devices, wherein the one or more silicon device disks and one or more flat heatsink devices are alternatingly stacked over one another along an alignment path that passes centrally through the silicon disk devices and normally to the parallel opposing faces such that each silicon device disk is separated from each other silicon device disk by at least one flat heatsink device, wherein adjacent silicon device disks and heatsink devices include centering holes for accommodating a centering pins between the adjacent devices, and wherein each heatsink device is pierced with two guide holes disposed diametrically opposite and equidistantly from a point of intersection of the alignment path and the pierced heatsink device, the method comprising:
- inserting two guide rods through the guide holes, with two spreader tools placed to both sides of the faulty silicon device, and
- applying a compressed medium to the spreader tools to cause two heatsink devices closest to and on opposite sides of the faulty silicon device to pull apart, freeing the faulty silicon device for removal and replacement.
Dependencies are inferred from the claim text.