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US 8,896,016 B2Granted
LED lighting module and method of making the same
AssigneeRohm Co., Ltd.
InventorHiroyoshi Sakaguchi
Life of this patent
Estimating the term…
Abstract
An LED lighting module includes a substrate and an LED chip mounted on the substrate. The substrate includes a base made of metal and an insulating layer. The base includes a principal surface and a raised portion above the principal surface. The insulating layer covers the principal surface of the base and exposes at least a part of the raised portion. The LED chip is supported on the raised portion.
Claims27
An LED lighting module, comprising:
- a substrate including a base and an insulating layer, the base being made of metal and including a principal surface and a raised portion raised above the principal surface, the insulating layer covering the principal surface of the base and exposing at least a part of the raised portion;
- and
- an LED chip supported on the raised portion,
- wherein the substrate includes a wiring layer formed on the insulating layer,
- wherein the raised portion includes a top surface and an inclined surface, the top surface being parallel to the principal surface, the inclined surface connecting the top surface and the principal surface to each other,
- wherein the insulating layer exposes the top surface of the raised portion, and
- wherein the base includes a recessed portion which is on an opposite side from the raised portion in a thickness direction and which overlaps the raised portion as viewed in the thickness direction.
4 more elements
An LED lighting module, comprising:
- a substrate including a base and an insulating layer, the base being made of metal and including a principal surface and a raised portion raised above the principal surface, the insulating layer covering the principal surface of the base and exposing at least a part of the raised portion;
- and
- an LED chip supported on the raised portion,
- wherein the substrate includes a wiring layer formed on the insulating layer,
- wherein the raised portion includes a top surface and an inclined surface, the top surface being parallel to the principal surface, the inclined surface connecting the top surface and the principal surface to each other,
- wherein the LED chip is bonded to the raised portion via a metal bonding layer,
- wherein the substrate includes a base plating layer disposed between the metal bonding layer and the top surface, and
- wherein the base plating layer comprises a plurality of layers including a top layer made of Au.
5 more elements
An LED lighting module, comprising:
- a substrate including a base and an insulating layer, the base being made of metal and including a principal surface and a raised portion raised above the principal surface, the insulating layer covering the principal surface of the base and exposing at least a part of the raised portion;
- and
- an LED chip supported on the raised portion,
- wherein the substrate includes a wiring layer formed on the insulating layer,
- wherein the raised portion includes a top surface and an inclined surface, the top surface being parallel to the principal surface, the inclined surface connecting the top surface and the principal surface to each other,
- wherein the LED chip is bonded to the raised portion via a metal bonding layer,
- wherein the substrate includes a base plating layer disposed between the metal bonding layer and the top surface, and
- wherein the wiring layer includes a base layer and a wiring plating layer, the base layer being formed on the insulating layer, the wiring plating layer covering the base layer.
5 more elements
An LED lighting module comprising:
- a substrate including a base and an insulating layer, the base being made of metal and including a principal surface and a raised portion raised above the principal surface, the insulating layer covering the principal surface of the base and exposing at least a part of the raised portion;
- and
- an LED chip supported on the raised portion,
- wherein the substrate includes a wiring layer formed on the insulating layer,
- wherein the raised portion includes a top surface and an inclined surface, the top surface being parallel to the principal surface, the inclined surface connecting the top surface and the surface to each other,
- wherein the LED lighting module further comprising:
- a sub-mount substrate disposed between the raised portion and the LED chip;
- and
- wherein a reflective resin exposes a surface of the sub-mount substrate on which the LED chip is mounted, the reflective resin covering at least a part of each of the wiring layer and the insulating layer.
6 more elements
An LED lighting module, comprising:
- a substrate including a base and an insulating layer, the base being made of metal and including a principal surface and a raised portion raised above the principal surface, the insulating layer covering the principal surface of the base and exposing at least a part of the raised portion;
- and
- an LED chip supported on the raised portion,
- wherein the substrate includes a wiring layer formed on the insulating layer,
- wherein the raised portion includes a top surface and an inclined surface, the top surface being parallel to the principal surface, the inclined surface connecting the top surface and the principal surface to each other,
- wherein the LED chip is bonded to the raised portion via a metal bonding layer,
- wherein the substrate includes a base plating layer disposed between the metal bonding layer and the top surface,
- wherein, in a direction in which the principal surface faces, the top surface of the raised portion is farther away from the principal surface than the wiring layer is, and
- the LED lighting module further comprises a reflective resin exposing the base plating layer and covering at least a part of each of the wiring layer and the insulating layer.
6 more elements
An LED lighting module comprising:
- a substrate including a base and an insulating layer, the base being made of metal and including a principal surface and a raised portion raised above the principal surface, the insulating layer covering the principal surface of the base and exposing at least a part of the raised portion;
- an LED chip supported on the raised portion;
- and
- a case including a reflective surface surrounding the LED chip,
- wherein in an internal space surrounded by the reflective surface of the case are arranged said LED chip and at least one additional LED chip that emits light of a different wavelength from light emitted from said LED chip, and
- wherein the additional LED chip is mounted at a position avoiding the raised portion.
3 more elements
An LED lighting module comprising:
- a substrate including a base and an insulating layer, the base being made of metal and including a principal surface and a raised portion raised above the principal surface, the insulating layer covering the principal surface of the base and exposing at least a part of the raised portion;
- an LED chip supported on the raised portion;
- and
- a case including a reflective surface surrounding the LED chip,
- wherein the case includes two internal spaces surrounded by the reflective surface,
- wherein the LED chip and the raised portion are arranged in one of the internal spaces, and
- wherein at least one additional LED chip that emits light of a different wavelength from light emitted from the LED chip is arranged in the other one of the internal spaces.
4 more elements
An LED lighting module comprising:
- a substrate including a base, an insulating layer and wiring, the base being made of metal and including a principal surface, the insulating layer covering the principal surface of the base, the wiring extending on the insulating layer;
- a seat portion including an upper surface that is offset from the principal surface and the insulating layer of the substrate in a direction normal to the principal surface;
- an LED chip supported on the upper surface of the seat portion;
- a case including a reflective surface surrounding the LED chip;
- a reflective resin covering the insulating layer, a side surface of the seat portion and the wiring, the reflective resin being configured to reflect light emitted from the LED chip;
- and
- a sealing resin filled in the case and containing a fluorescent substance made of a sulfide, the fluorescent substance emitting light of a different wavelength from light emitted from the LED chip when excited by the light from the LED chip.
4 more elements
A method of making an LED lighting module, the method comprising the steps of:
- preparing a metal plate including a principal surface and a reverse surface facing away from each other in a thickness direction;
- forming an insulating layer covering the principal surface;
- forming a raised portion raised above the principal surface and a recessed portion recessed from the reverse surface by moving a part of the metal plate in a direction from the reverse surface toward the principal surface;
- exposing at least a part of the raised portion by removing a part of the insulating layer;
- and
- mounting the LED chip on the raised portion,
- wherein the step of forming the raised portion and the recessed portion comprises forming a top surface in the raised portion such that the top surface is parallel to the principal surface, and
- the step of exposing at least a part of the raised portion comprises preparing a removal tool with an edge extending along the top surface, and working the removal tool in such a manner that the edge moves along the top surface, thereby removing only a portion of the insulating layer which covers the top surface.
5 more elements
Dependencies are inferred from the claim text.