US 8,896,013 B2 · High density multi-chip LED devices

Abstract

High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

Claims21

Dependent claims

An LED device comprising:

a submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least two semicircular areas of metal;
at least two groups of LED chips fixed to the submount wherein all the LED chips within a group are connected in parallel to one of the at least two semicircular areas of metal;
and
a plurality of wire bonds, each connected between an LED chip from among the at least two groups of LED chips and the submount, the plurality of wire bonds arranged so that all the wire bonds are disposed on the outside of at least one group of the at least two groups of LED chips and the groups of LED chips are connected in series.

1 more element

Dependencies are inferred from the claim text.

High density multi-chip LED devices

Life of this patent

High density multi-chip LED devices

Life of this patent

Abstract

Claims21