Wafer-level flip chip device packages and related methods

An electronic device comprising:

• a solid shaped volume of a polymeric binder;
• suspended within the binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a bare-die light-emitting element comprising a plurality of active semiconductor layers that cooperatively emit light;
• disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a terminal end not covered by the polymeric binder, the contacts each contacting a different active semiconductor layer of the semiconductor die;
• and
• disposed over a portion of the polymeric binder and in electrical contact with the terminal ends of the contacts, an anisotropic conductive adhesive (ACA),
• wherein (i) at least a portion of the polymeric binder is transparent to a wavelength of light emitted by the bare-die light-emitting element and (ii) the polymeric binder contains therein a wavelength-conversion material for absorption of at least a portion of light emitted from the bare-die light-emitting element and emission of converted light having a different wavelength, converted light and unconverted light emitted by the bare-die light-emitting element combining to form mixed light.