Mounting structure of electronic component
AssigneeKoa Corporation
InventorToshifumi Mizokami
Life of this patent
Estimating the term…
Abstract
Electrode protective films 13a and 13b are formed on the surface of the metal layer using imidazole preflux, as terminal electrodes 35a and 35b of an electronic component. The terminal electrodes of an electronic component on which the protective films are formed are fixed by electroconductive adhesives 33a and 33b supplied to mounting lands 40a and 40b. Thereby an electronic component mounting structure without change in resistance caused by electroconductive adhesives is provided.
Claims3
An electronic component mounting structure having a configuration in which an electroconductive adhesive made of a resin containing a conductive filler is supplied to a circuit board on which is formed a mounting land and a wiring pattern, and a terminal electrode of an electronic component is connected to the mounting land via the electroconductive adhesive, wherein
- the terminal electrode comprises a metal layer made of electrolytic-plated copper and an electrode protective film formed on the surface of the metal layer and on the outermost surface of the terminal electrode using imidazole preflux which forms a complex with copper, where the terminal electrode is fixed on the mounting land while maintaining a conductivity at a junction of the electrode protective film and the electroconductive adhesive.
Dependencies are inferred from the claim text.