Printed circuit board structure
AssigneesQuanta Computer Inc., Tech-Front (Shanghai) Computer Co. Ltd.
InventorsSteven Wang, Jin-Chang Wu, Mide Yang
Life of this patent
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Abstract
A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof.
Claims10
A printed circuit board structure comprising a plurality of circuit layer plates stacked together, and each of the circuit layer plates comprising:
- an epoxy resin plate body;
- and
- a fiber fabric completely encapsulated inside the epoxy resin plate body,
- wherein each of the circuit layer plates which is stacked between two of the circuit layer plates is further provided with filler particles distributed in the epoxy resin plate body of the circuit layer plate;
- and
- wherein, in all of the circuit layer plates, the two opposite and outermost circuit layer plates thereof are provided with metal soldering pads on outer surfaces of the epoxy resin plate bodies of the two opposite and outermost circuit layer plates, respectively, and both the two opposite and outermost circuit layer plates thereof are free of the filler particles in the epoxy resin plate body thereof.
A printed circuit board structure comprising:
- two opposite and outermost circuit layer plates, each of the two opposite and outermost circuit layer plates comprising a first epoxy resin plate body, a metal soldering pad and a first fiber fabric, wherein the metal soldering pad is bonded on an outer surface of the first epoxy resin plate body, and the first fiber fabric is completely encapsulated inside the first epoxy resin plate body;
- and
- a middle layer comprising at least one circuit layer plate stacked between the two opposite and outermost circuit layer plates, and each of the at least one circuit layer plate comprising a second epoxy resin plate body, a second fiber fabric completely encapsulated inside the second epoxy resin plate body, and filler particles distributed in the second epoxy resin plate body,
- wherein among the two opposite and outermost circuit layer plates and the at least one circuit layer plate of the middle layer, only the second epoxy resin plate body of the at least one circuit layer plate of the middle layer has the filler particles therein.
A printed circuit board structure comprising:
- two opposite and outermost circuit layer plates, each of the two opposite and outermost circuit layer plates comprising:
- a first epoxy resin plate body;
- a metal soldering pad bonded on an outer surface of the first epoxy resin plate body;
- a first fiber fabric completely encapsulated inside the first epoxy resin plate body;
- and
- a plurality of first filler particles distributed in the first epoxy resin plate body with a first weight percentage, wherein the first weight percentage is greater than zero;
- and
- at least one middle circuit layer plate stacked between the two opposite and outermost circuit layer plates, and comprising:
- a second epoxy resin plate body;
- a second fiber fabric completely encapsulated inside the second epoxy resin plate body;
- and
- a plurality of second filler particles distributed in the second epoxy resin plate body with a second weight percentage, wherein the second weight percentage is greater than the first weight percentage.
Dependencies are inferred from the claim text.