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US 8,895,864 B2Granted
Deformable apparatus and method
AssigneeNokia Corporation
InventorsDarryl Cotton, Samiul Md Haque, Piers Andrew
Life of this patent
Estimating the term…
Abstract
An apparatus and method wherein the apparatus includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.
Claims20
An apparatus comprising:
- a deformable substrate;
- a conductive portion;
- and
- at least one support configured to couple the conductive portion to the deformable substrate so that:
- the conductive portion is spaced from the deformable substrate;
- the conductive portion does not directly contact the deformable substrate when the apparatus is in a deformed state;
- and
- a force applied to the deformable substrate does not cause the deformable substrate and the conductive portion to bend or change size or shape in the same way.
5 more elements
A method comprising:
- coupling a conductive portion to a deformable substrate using at least one support such that:
- the conductive portion is spaced from the deformable substrate;
- the conductive portion does not directly contact the deformable substrate when the apparatus is in a deformed state;
- and
- a force applied to the deformable substrate does not cause the deformable substrate and the conductive portion to bend or change size or shape in the same way.
2 more elements
Dependencies are inferred from the claim text.