Cycloolefin resin composition
AssigneePolyplastics Co., Ltd.
InventorsToshio Nakane, Daisaku Ikeda
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Abstract
A cycloolefin resin composition which controls the flexibility of a cycloolefin resin and may be molded in an environment having a temperature exceeding about 140° C. is provided. A cycloolefin resin film, a cycloolefin resin preform and the like are provided utilizing the cycloolefin resin composition including two or more cycloolefin copolymer resins having Tg values different from each other by about 10° C. or more, and the storage modulus of about 120° C. (E′120) relative to the storage modulus of about 50° C. (E′50), namely E′120/E′50 is set within the range of about 0.15 to about 0.65.
Claims6
A cycloolefin resin composition comprising:
- at least two types of cycloolefin copolymer resins, wherein:
- 1) a Tg of a cycloolefin resin having the highest Tg is no less than 120° C. and no more than 200° C.;
- 2) a Tg of a cycloolefin resin having the lowest Tg is no less than 70° C. and no more than 100° C.;
- and
- 3) the difference between the Tg value of the cycloolefin resin having the highest Tg and the Tg value of the cycloolefin resin having the lowest Tg is between 70° C. and 120° C.;
- and
- wherein a ratio (E′120/E′50) of storage modulus of about 120° C. (E′120) relative to storage modulus of about 50° C. (E′50) falls within the range of from about 0.15 to about 0.65;
- and wherein the storage modulus (E′150) at 150° C. is no less than 1×108.
Dependencies are inferred from the claim text.