Low resistivity tungsten PVD with enhanced ionization and RF power coupling

A plasma processing chamber comprising:

• a target having a first surface that is in contact with a processing region and a second surface that is opposite the first surface;
• an RF or DC power supply coupled to the target;
• a grounded shield that at least partially encloses a portion of the processing region and is electrically coupled to a ground and thermally coupled to a heater;
• a substrate support having a substrate receiving surface disposed below the target, the substrate support further comprising an electrode disposed below the substrate receiving surface;
• a cover ring;
• a deposition ring disposed over a portion of the substrate support;
• a pedestal grounding assembly disposed below the substrate support comprising a plate having a U-shaped portion that extends between a substrate support assembly and a ring support portion of the grounded shield;
• and
• a magnetron disposed adjacent to the second surface of the target, wherein the magnetron comprises:
• an outer pole comprising a plurality of magnets;
• and
• an inner pole comprising a plurality of magnets, wherein the outer and inner poles form a closed-loop magnetron assembly, wherein the outer pole and the inner pole each create a magnetic field, and wherein the ratio of the magnetic fields generated by the outer and inner poles is between about 1.56 and about 0.57.