Method for forming a multi-level surface on a substrate with areas of different wettability and a semiconductor device having the same
AssigneeNederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
InventorsMaria Peter, Erwin Rinaldo Meinders
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Abstract
The invention relates to a method 10 for forming a multi-level surface on a substrate 2, wherein said surface comprises areas of different wettability, the method comprising the step (A, B) of applying a multi-level stamp to the substrate for forming the multi-level surface, said multi-level stamp having different structural regions 1a arranged along the multi-level surface for locally altering wettability properties of at least a portion of a level of the multi-level surface 2a, 2b. The invention further relates to a semiconductor device and a method for manufacturing a semiconductor device.
Claims20
A method for forming a multi-level surface on a substrate for manufacturing a semiconductor device, said surface comprising areas of different wettability, the method comprising the step of:
- applying a multi-level stamp to the substrate for forming the multi-level surface of the semiconductor device, said multi-level stamp having different structural regions arranged along the multi-level surface of the stamp for locally altering wettability properties of at least a portion of a level of the multi-level surface of the substrate.
A method for manufacturing a semiconductor device, the method comprising the step of:
- applying a multi-level stamp to a substrate for forming a multi-level surface that comprises areas of different wettability, said multi-level stamp having different structural regions arranged along the multi-level surface of the stamp for locally altering wettability properties of at least a portion of a level of the multi-level surface of the substrate.
Dependencies are inferred from the claim text.