Method of forming channel layer of electric device and method of manufacturing electric device using the same
AssigneeSnu R&Db Foundation
InventorsYoung June Park, Seok Ha Lee, Jun Ho Chun, Yeonkyu Choi
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Abstract
A method of forming a channel layer of an electric device according to an embodiment is provided. First, a conductive substrate including an insulating layer on the substrate is provided. The conductive substrate and a metal to be plated are used as respective electrodes to carry out electroplating within an electrolyte solution. In this case, electrons provided by a tunneling current passing through the insulating layer from the conductive substrate are bonded with ions of the metal within the electrolyte solution to form a metal channel layer on the insulating layer.
Claims17
A method of forming a channel layer of an electric device, comprising:
- (a) providing a conductive substrate having an insulating layer formed on a surface of the substrate;
- (b) immersing the conductive substrate and a metal to be plated into an electrolyte solution;
- and
- (c) applying a voltage to generate a tunneling current caused by electrons passing through the insulating layer from the conductive substrate using the conductive substrate and the metal as respective electrodes, and bonding ions of the metal within the electrolyte solution with the electrons that have tunneled through the insulating layer to form a metal channel layer on the insulating layer,
- after (a) providing a conductive substrate with an insulating layer, forming at least one electrode layer on the insulating layer;
- wherein in (c) bonding the ions of the metal with the electrons, when the metal channel layer is connected to the at least one electrode layer, bonding the ions of the metal with the electrons is stopped at the metal channel layer.
A method of manufacturing an electric device, comprising:
- (a) forming an insulating layer on a conductive substrate;
- (b) forming a source electrode layer and a drain electrode layer to be spaced from each other on the insulating layer;
- (c) immersing the conductive substrate including the insulating layer, the source electrode layer, and the drain electrode layer into an electrolyte solution;
- and
- (d) carrying out electroplating using the conductive substrate and a metal to be plated as respective electrodes,
- wherein electrons of a tunneling current passing through the insulating layer from the conductive substrate are bonded with ions of the metal within the electrolyte solution to form a metal channel layer on the insulating layer between the source electrode layer and the drain electrode layer,
- wherein (d) carrying out the electroplating includes applying a voltage between the source electrode layer and the drain electrode layer and measuring a current flowing between the source electrode layer and the drain electrode layer to determine whether the electroplating forming the metal channel layer is completed.
A method of manufacturing an electric device, comprising:
- (a) forming an insulating layer on a conductive substrate;
- (b) forming a source electrode layer and a drain electrode layer to be spaced from each other on the insulating layer;
- (c) forming a base metal layer on the conductive substrate including the insulating layer, the source electrode layer, and the drain electrode layer;
- (d) applying a photoresist on the conductive substrate, and forming a photoresist pattern exposing a portion of the base metal layer through a lithography process;
- (e) removing the exposed portion of the base metal layer to expose a portion of the insulating layer;
- and
- (f) carrying out electroplating using the conductive substrate and a metal to be plated as respective electrodes within an electrolyte solution,
- wherein electrons of a tunneling current passing through the insulating layer from the conductive substrate are bonded with ions of the metal within the electrolyte solution to form a metal channel layer on the portion of the insulating layer.
Dependencies are inferred from the claim text.