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US 8,895,422 B2Granted
Production of an integrated circuit including electrical contact on SiC
AssigneeInfineon Technologies Austria AG
InventorsRoland Rupp, Thomas Gutt, Michael Treu
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Abstract
Production of an integrated circuit including an electrical contact on SiC is disclosed. One embodiment provides for production of an electrical contact on an SiC substrate, in which a conductive contact is produced on a boundary surface of the SiC substrate by irradiation and absorption of a laser pulse on an SiC substrate.
Claims7
A method for producing an integrated circuit including an electrical contact on an SiC substrate comprising:
- providing the SiC substrate with an exposed SiC surface;
- irradiating the exposed SiC surface with a laser pulse such that the SiC substrate loses silicon by thermal action on the surface, and a carbon structure remains;
- and
- forming a contact reinforcement structure on the carbon structure.
1 more element
Dependencies are inferred from the claim text.