Semiconductor field-effect transistor structure and method for manufacturing the same
AssigneeInstitute of Microelectronics, Chinese Academy of Sciences
InventorsHuajie Zhou, Qiuxia Xu
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AssigneeInstitute of Microelectronics, Chinese Academy of Sciences
InventorsHuajie Zhou, Qiuxia Xu
Estimating the term…
The present application discloses a semiconductor Field-Effect Transistor (FET) structure and a method for manufacturing the same, wherein the method comprises: forming a semiconductor substrate comprising an SOI structure having a body-contact hole; forming a fin on the SOI structure of the semiconductor substrate; forming a gate stack structure on top and side faces of the fin; forming source/drain structures in the fin on both sides of the gate stack structure; and performing metallization. The present invention makes use of traditional quasi-planar based top-down processes, thus the manufacturing process thereof becomes simple to implement; the present invention exhibits good compatibility with CMOS planar process and can be easily integrated; the present invention also is favorable for suppressing short channel effects desirably, and boosts MOSFETs to develop towards a trend of downscaling size.
A manufacturing method, comprising:
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