Fabrication method of semiconductor package
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsJung-Pang Huang, Hui-Min Huang, Kuan-Wei Chuang, Chun-Tang Lin, Yih-Jenn Jiang
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Abstract
A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.
Claims10
A fabrication method of a semiconductor package, comprising the steps of:
- providing a carrier board;
- disposing a plurality of chips on the carrier board, wherein each of the chips has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, the active surface being attached to the carrier board;
- forming on the carrier board an encapsulant to encapsulate the chips, wherein the encapsulant has a first surface attached to the carrier board and a second surface opposite to the first surface;
- removing the carrier board to expose the active surfaces of the chips and the first surface of the encapsulant;
- forming first and second metal layers on all of the second surface of the encapsulant;
- and
- after forming the first and second metal layers, performing a singulation process.
Dependencies are inferred from the claim text.