Die preparation for wafer-level chip scale package (WLCSP)
AssigneeNXP B.V.
InventorsHartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder, Michael Zernack
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Abstract
Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) device from a wafer substrate, the method comprises grinding the back-side of the wafer substrate to a prescribed thickness. A plurality of trenches is sawed along a plurality of device die boundaries on a back-side surface of the wafer, the trenches having a bevel profile. The plurality of trenches is etched until the bevel profile of the plurality of trenches is rounded.
Claims6
A method for assembling a wafer level chip scale processed (WLCSP) device from a wafer substrate, the wafer substrate having a front-side surface with active device die and a back-side surface, the method comprising:
- grinding the back-side surface of the wafer substrate to a prescribed post-grind thickness;
- applying a protective film on front-side surface of the wafer substrate;
- sawing a plurality of trenches along a plurality of device die boundaries on the back-side surface of the wafer, the trenches having a bevel profile;
- and
- etching the plurality of trenches until the bevel profile of the plurality of trenches is rounded.
Dependencies are inferred from the claim text.