Integrated circuit and method of manufacturing the same
AssigneeNXP B.V.
InventorsTonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx
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Abstract
Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, the RDL defining a signal routing circuit. The method comprises the steps of: depositing the electrically conductive RDL so as to form an electrically conductive ring surrounding the signal routing circuit; and coating the side and lower surfaces of the die with an electrically conductive shielding material.
Claims9
A method of manufacturing a wafer level chip scale package, WLCSP, comprising a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, wherein the method comprises:
- depositing the electrically conductive RDL so as to define a signal routing circuit and form an electrically conductive ring surrounding the signal routing circuit;
- coating the side and lower surfaces of the die with an electrically conductive shielding material, wherein the electrically conductive shielding material contacts at least a portion of the periphery of the conductive ring;
- and
- wherein after depositing the electrically conductive RDL and prior to coating the side and lower surfaces of the die with an electrically conductive shielding material, removing at least a portion of the periphery of the conductive ring.
A method of manufacturing a wafer level chip scale package, WLCSP, comprising a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, wherein the method comprises:
- depositing the electrically conductive RDL so as to define a signal routing circuit and form an electrically conductive ring surrounding the signal routing circuit:
- coating the side and lower surfaces of the die with an electrically conductive shielding material, wherein the electrically conductive shielding material contacts at least a portion of the periphery of the conductive and
- wherein prior to depositing the electrically conductive RDL, etching trenches in the die surrounding the signal routing circuit.
Dependencies are inferred from the claim text.