Binder resin precursor solution composition for electrode
AssigneeUbe Industries, Ltd.
InventorsTetsuji Hirano, Toru Kidosaki
Life of this patent
Estimating the term…
Abstract
A binder resin precursor solution composition for electrode containing at least (A) a polyamic acid having repeating units represented by chemical formulae (1) and (2) in a (1) to (2) molar ratio of 2:8 to 8.5:1.5 and having a tetracarboxylic acid component to diamine component molar ratio of 0.94 to 0.99, (B) a carboxylic acid compound having two pairs of carboxyl groups in the molecule thereof or an ester thereof, and (C) a solvent.
Claims19
A binder resin precursor solution composition for electrode comprising (A) a polyamic acid comprising repeating units represented by chemical formulae (1) and (2) below in a (1) to (2) molar ratio of 2:8 to 8.5:1.5 and having a tetracarboxylic acid component to diamine component molar ratio of 0.94 to 0.99, (B) a carboxylic acid compound having two pairs of carboxyl groups per molecule or an ester thereof, and (C) a solvent
Dependencies are inferred from the claim text.