Structural adhesive and bonding application thereof
AssigneeCytec Technology Corp.
InventorsJunjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
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AssigneeCytec Technology Corp.
InventorsJunjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
Estimating the term…
A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.
A two-part system for forming a structural adhesive comprising a resinous part (A) and a separate catalyst part (B),
Dependencies are inferred from the claim text.