Polyamide resin composition and molded product

A polyamide resin composition, comprising

• (A) a polyamide comprising a diamine unit, comprising 30% by mole or more of an m-xylylenediamine unit, and a dicarboxylic acid unit,
• (B) an aromatic, secondary-amine-based compound, and
• (C) an organic, sulfur-based compound
• wherein a content ratio of the aromatic, secondary-amine-based compound (B) and the organic, sulfur-based compound (C) ((B)/(C) mass ratio) in the polyamide resin composition is from 0.1 to 5.0,
• wherein the organic sulfur based compound (C) is present in an amount of from 0.2 to 5 parts by mass based on 100 parts by mass of the polyamide (A), and
• wherein a 100 μm-thick film consisting of the polyamide resin composition has an oxygen permeability coefficient of not more than 1 cc·mm/ 2day·atm at 23 ° C. and 75 % RH, and has a tensile strength retention rate (%) of not less than 92% as calculated according to the following expression (1):
• Tensile strength retention rate (%) =[{Stress at break (MPa) of film after heat treatment}/{Stress at break (MPa) of film before heat treatment}]×100 (1)
• where the stress at break (MPa) in this expression is tested in conformity with JIS K7127 by using the film before and after heat treatment at 130° C. for 72 hours.