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US 8,895,121 B2Granted
Polyamide resin composition and molded article
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsJun Mitadera, Masashi Kurokawa
Life of this patent
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Abstract
Disclosed is a polyamide resin composition having excellent gas barrier properties and heat aging resistance, which contains (A) a polyamide composed of a diamine unit containing a 1,3-bis(aminomethyl)cyclohexane unit and a dicarboxylic unit and at least either of (B) an aromatic secondary amine based compound and (D) a phenol based antioxidant and has an oxygen permeability coefficient of not more than 1.5 cc·mm/m2·day·atm at 23° C. and 75% RH.
Claims18
A polyamide resin composition, comprising:
- (A) a polyamide comprising (a1) a diamine unit comprising a 1,3-bis(aminomethyl)cyclohexane unit and (a2) a dicarboxylic acid unit;
- (B) an aromatic secondary amine compound;
- (C) an organic sulfur compound;
- and
- (D) a phenolic antioxidant,
- wherein
- a content ratio of the aromatic secondary amine compound (B) to the organic sulfur compound (C), (B)/(C) mass ratio, in the composition is from 0.5 to 10.0,
- a content ratio of the phenolic antioxidant (D) to the organic sulfur compound (C), (D)/(C) mass ratio, in the composition is from 0.5 to 10.0, and
- the composition has an oxygen permeability coefficient of not more than 1.5 cc·mm/m2·day·atm at 23° C. and 75% RH.
6 more elements
Dependencies are inferred from the claim text.