Chemical vapor deposition with elevated temperature gas injection

A method of chemical vapor deposition comprising:

• (a) supporting one or more substrates on a carrier within a reaction chamber so that surfaces of the substrates face upwardly within the chamber, while rotating the carrier about a vertical axis and maintaining the substrates at a substrate temperature of 400° C. or higher;
• and
• (b) directing gases including a Group III metal organic compound and a Group V hydride into the chamber from an inlet element disposed above the substrates so that the Group III metal organic compound and the Group V hydride flow downward toward the substrates as substantially separate streams in a flow region extending downwardly from the flow inlet element and then flow outward away from the axis over the surfaces of the substrates in a boundary region between the flow region and the substrates and react to form a III-V compound on the substrates, and so that the gases flow in non-recirculating operation, the gases being at an inlet temperature above about 75° C. when introduced into the chamber.