Polymeric edge seal for bonded substrates

A method of forming a bonded structure comprising:

• applying a polymer material on a surface of a first substrate;
• removing a portion of said polymer material from a center portion of said surface of said first substrate;
• bonding, after removing said portion of said polymer material, a second substrate to said surface of said first substrate, wherein adhesion between said first and second substrates is provided by bonding of materials across an intersubstrate interface between said first and second substrates;
• and
• forming a polymeric ring including said polymer material, wherein said polymeric ring contacts a first non-flat surface of said first substrate at a first polymer-to-non-polymer interface and a second non-flat surface of said second substrate at a second polymer-to-non-polymer interface.