Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method

A method of manufacturing an organic light-emitting display device by using a thin film deposition apparatus to form a thin film on a substrate, the method comprising:

• arranging the substrate to be separated from the thin film deposition apparatus by a distance;
• and
• depositing a deposition material discharged from the thin film deposition apparatus onto the substrate while one of the thin film deposition apparatus and the substrate is moved relative to the other of the thin film deposition apparatus and the substrate,
• wherein the thin film deposition apparatus comprises a plurality of thin film deposition assemblies, each of the plurality of thin film deposition assemblies comprising:
• a deposition source that includes the deposition material, the deposition source to discharge the deposition material;
• a deposition source nozzle unit arranged at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction;
• a patterning slit sheet arranged opposite to the deposition source nozzle unit and having a plurality of patterning slits arranged in the first direction;
• and
• a barrier plate assembly including a plurality of barrier plates arranged in the first direction, the barrier plate assembly being arranged between the deposition source nozzle unit and the patterning slit sheet, the barrier plate assembly to partition a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces;
• wherein the deposition material includes a material selected from the group consisting of a red (R) emission layer, a green (G) emission layer, a blue (B) emission layer and a first auxiliary layer, and
• wherein the deposition materials respectively arranged within the deposition sources of the plurality of thin film deposition assemblies are sequentially deposited on the substrate.