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US 8,894,406 B2Granted
Patterning mold and manufacturing method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsEui Sun Choi, Eun Soo Hwang, Young Tae Cho, Dong Min Kim, Jeong Gil Kim, Jong Woo Lee, Eun Ah Park
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Abstract
Disclosed herein is a patterning mold configured to form a micropattern on a substrate or glass. The disclosed patterning mold includes a transfer body with a patterning part formed at one end of the transfer body to transfer a nanoparticle material to one surface of the substrate. The patterning mold further includes a fixing member coupled to an exterior of the transfer body, to prevent or reduce deformation of the exterior of the transfer body.
Claims10
A patterning mold, comprising:
- a transfer body, the transfer body including a patterning part at one end of the transfer body, a fixing part at the other end of the transfer body, and a hinge part between the patterning part and the fixing part, the patterning part having recesses and projections and configured to transfer a nanoparticle material to a surface of a substrate, the transfer body being a monolithic body and formed of a flowable and curable material;
- and
- a fixing member coupled to an exterior of the transfer body, the fixing member being configured to reduce a deformation of the exterior of the transfer body,
- wherein the patterning part is wider than the hinge part and the hinge part has a rod shape and connects the fixing part and the patterning part together.
1 more element
Dependencies are inferred from the claim text.