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US 8,894,249 B2Granted
LED module and method of bonding thereof
AssigneeTSMC Solid State Lighting Ltd.
InventorWei-Yu Yeh
Life of this patent
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Abstract
The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).
Claims20
A lighting apparatus, comprising:
- a thermally conductive structure that contains a first material;
- a printed circuit board disposed over the thermally conductive structure, wherein the printed circuit board includes:
- a base layer that contains a second material, wherein the thermally conductive structure and the base layer are bonded together without a connective means or an adhesive;
- a dielectric layer disposed over the base layer;
- and
- a conductor layer disposed over the dielectric layer;
- and
- a photonic device disposed over the printed circuit board.
5 more elements
A lighting apparatus, comprising:
- a heat sink that contains a first metal;
- a metal core printed circuit board (MCPCB) disposed over the heat sink, wherein the MCPCB includes:
- a base metal layer that contains a second metal;
- a thermally conductive dielectric layer disposed over the base metal layer;
- and
- a conductor layer disposed over the thermally conductive dielectric layer;
- a bond structure that bonds the heat sink and the base metal layer of the MCPCB together, wherein the bond structure contains a mixture of the first metal and the second metal;
- and
- a light-emitting diode (LED) disposed over the conductor layer of the MCPCB, and wherein the LED is electrically coupled to the conductor layer.
6 more elements
A method, comprising:
- providing a heat sink that contains a first metal;
- providing a metal core printed circuit board (MCPCB) that includes:
- a base metal layer that contains a second metal;
- a thermally conductive dielectric layer disposed over the base metal layer;
- and
- a conductor layer disposed over the thermally conductive dielectric layer;
- and
- bonding the heat sink with the base metal layer of the MCPCB using ultrasonic energy to create a mixture of the first metal and the second metal between the heat sink and the base metal layer.
5 more elements
Dependencies are inferred from the claim text.