Light-emitting device and method of manufacturing the same
AssigneeToyoda Gosei Co., Ltd.
InventorsYoshinobu Suehiro, Koji Tasumi
Life of this patent
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Abstract
A light-emitting device includes a light emitting portion including a substrate having a mounting surface for mounting an LED element and a metal portion formed on a surface of the substrate opposite to the mounting surface, the substrate including a ceramic or a semiconductor and the metal portion being bondable to a solder material and a heat dissipating member including one of aluminum, an aluminum alloy, magnesium, and a magnesium alloy, and having, on a surface thereof, a junction treated so as to be bondable to the solder material and a heat dissipating film formed in a periphery of the junction, wherein the metal portion of the light emitting portion is bonded to the junction of the heat dissipating member by the solder material.
Claims19
A light-emitting device, comprising:
- a light emitting portion comprising a substrate comprising a mounting surface for mounting a light-emitting diode (LED) element and a metal portion formed on a surface of the substrate opposite to the mounting surface, the substrate comprising a ceramic or a semiconductor and the metal portion being bondable to a solder material;
- a heat dissipating member comprising one of aluminum, an aluminum alloy, magnesium and a magnesium alloy;
- and a circuit pattern formed on the heat dissipating member and electrically connected to the LED element of the light emitting portion by mounting the light emitting portion on the heat dissipating member, wherein a surface of the heat dissipating member includes a junction treated so as to be bondable to the solder material and a heat dissipating film formed in a periphery of the junction, wherein the metal portion of the light emitting portion is bonded to the junction of the heat dissipating member by the solder material, wherein no oxide film is formed on the junction of the heat dissipating member, wherein the solder material comprises a material that is impossible to be directly bonded to the heat dissipating member, wherein the heat dissipating member further comprises a plate-shaped main body, wherein the light emitting portion is mounted on an end surface of the main body of the heat dissipating member, and wherein a longitudinal length of the end surface in the metal portion of the light emitting portion is less than 200/X [mm] where X [10-6/° C.] is a difference between a rate of thermal expansion of the heat dissipating member and a rate of thermal expansion of the substrate of the light emitting portion.
A light-emitting device, comprising:
- a light emitting portion, comprising:
- a substrate comprising a mounting surface for mounting a light-emitting diode (LED) element;
- and mounting surface, the substrate comprising one of a ceramic and a semiconductor;
- a solder material bonded to the metal portion;
- a heat dissipating member, wherein a surface of the heat dissipating member comprises a junction treated to be bonded to the metal portion via the solder material;
- a heat dissipating film disposed in a periphery of the junction;
- and a circuit pattern formed on the heat dissipating member and electrically connected to the LED element of the light emitting portion by mounting the light emitting portion on the heat dissipating member,
- wherein no oxide film is formed on the junction of the heat dissipating member, wherein the solder material comprises a material that is impossible to be directly bonded to the heat dissipating member, wherein the heat dissipating member further comprises a plate-shaped main body,
- wherein the light emitting portion is mounted on an end surface of the main body of the heat dissipating member, and wherein a longitudinal length of the end surface in the metal portion of the light emitting portion is less than 200/X [mm] where X [10-6/° C.] is a difference between a rate of thermal expansion of the heat dissipating member and a rate of thermal expansion of the substrate of the light emitting portion.
Dependencies are inferred from the claim text.