Tamper-resistant electronic system
AssigneeAutomated Assembly Corporation
InventorsScott Lindblad, David Neuman, Robert Neuman
Life of this patent
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Abstract
A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.
Claims24
A tamper-resistant electronic system, comprising:
- a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate;
- an RFID device having pins mechanically and electrically connected to the conductive wiring on the first surface of the DV substrate;
- a plate having a first surface, wherein a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate, and the plate has a cavity that encompasses the RFID device;
- and
- a backing adhered to a second surface of the plate opposite the first surface of the plate.
A tamper-resistant electronic system, comprising:
- a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate;
- an RFID device having pins mechanically and electrically connected to the conductive wiring on the first surface of the DV substrate;
- a plate having a first surface and being more rigid than the DV substrate, wherein a portion of the first surface of the plate, exclusive of an area of the first surface of the plate that surrounds the RFID device, is adhered to a portion of the first surface of the DV substrate, and the plate has a cavity that encompasses the RFID device;
- a backing adhered to a second surface of the plate opposite the first surface of the plate;
- and
- an adhesive layer on a second surface of the DV substrate, and a temporary backing attached to the adhesive layer on the second surface of the DV substrate.
Dependencies are inferred from the claim text.