Back to results
US 8,893,953 B2Granted
Wire bonding method in circuit device
AssigneeSamsung Electronics Co., Ltd.
InventorJoon-gil Lee
Life of this patent
Estimating the term…
Abstract
A wire bonding method in a circuit device mounted on a lead frame, the wire bonding method including: counting a stop time if an operation of a capillary stops; removing a contaminated free air ball (FAB) formed on an end of the capillary if the stop time exceeds a reference time; forming a new FAB; and restarting a wire bonding process.
Claims12
A wire bonding method in a circuit device, the wire bonding method comprising:
- detecting a stop time duration while an operation of a capillary is stopped;
- removing a contaminated free air ball (FAB) formed on a wire at an end of the capillary if the stop time duration exceeds a reference time;
- and
- forming a new FAB and restarting a wire bonding process.
1 more element
A method comprising:
- detecting an error while a wire bonding process is performed by supplying a wire via a capillary;
- stopping the wire bonding process to remove the detected error;
- determining whether a stop time duration of an idle state of the wire bonding process exceeds a reference time;
- removing a contaminated wire portion from the capillary if the stop time duration is more than the reference time, and restarting the wire bonding process after the contaminated wire portion is removed;
- and
- continuing the wire bonding process if the stop time duration is less than or equal to the reference time.
3 more elements
Dependencies are inferred from the claim text.