Heat sink assembly for electronic components
AssigneeSchneider Electric It Corporation
InventorGorm Gamborg
Life of this patent
Estimating the term…
Abstract
One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. The heat sink assembly includes a heat sink having a base and at least one fin extending from the base. The at least one fin has an opening formed therein that is configured to receive a fastener. The heat sink assembly also includes a clip. The clip has a first portion configured to receive the fastener and at least one second portion flexibly coupled to the first portion. The at least one second portion is configured to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the first portion by the fastener.
Claims17
A heat sink assembly for dissipating heat from an electronic component, the heat sink assembly comprising:
- a heat sink including a base having a surface configured to engage the electronic component, the heat sink further including at least one fin extending from the base in a direction perpendicular to a direction of the surface of the base, the at least one fin having a first surface, a second surface opposite the first surface, and an opening formed therein extending from the first surface to the second surface, the opening being configured to receive a fastener;
- and
- a clip including a first portion having a first leg configured to engage the second surface of the at least one fin and a second leg coupled to the first leg by a curved portion, the second leg being spring biased away from the first leg, the clip further including a second portion coupled to the first portion, the second portion being configured to engage the electronic component to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the second leg by the fastener in which the second leg engages the first leg.
A heat sink assembly for dissipating heat from an electronic component, the heat sink assembly comprising:
- a heat sink including a base having a first surface configured to engage the electronic component, the heat sink further including a first fin extending from the first surface of the base, the first fin having a first opening formed therein that is configured to receive a fastener, and a second fin extending from the first surface of the base, the second fin being disposed above the first fin and having a second opening aligned with the opening of the first fin and configured to receive the fastener therethrough, the first fin and the second fin extending from the base in a direction perpendicular to a direction of the base, the first fin having a top surface and a bottom surface opposite the first surface;
- and
- a clip including a first portion having a first leg and a second leg coupled to the first leg by a curved portion, the second leg being spring biased away from the first leg, each of the first leg and the second leg having a clip opening formed therein and configured to be aligned with the first opening of the first fin to receive the fastener to secure the clip to the first fin in response to a force being applied to the first portion by the fastener.
A method of securing a heat sink assembly to an electronic component, the heat sink assembly including a clip and a heat sink, wherein the heat sink includes a base having a surface configured to engage the electronic component, the heat sink further including a first fin extending from the base in a direction perpendicular to a direction of the surface of the base, the first fin having a top surface, a bottom surface opposite the top surface, and a first opening formed therein extending from the top surface to the bottom surface, the first opening being configured to receive a fastener, wherein the clip includes a first portion having a first leg configured to engage the bottom surface of the at least one fin and a second leg coupled to the first leg by a curved portion, the second leg being spring biased away from the first leg, the clip further including a second portion coupled to the first portion, the second portion being configured to engage the electronic component to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the second leg by the fastener in which the second leg engages the first leg, the method comprising:
- positioning the heat sink assembly on the electronic component in such a manner that the base is disposed adjacent the electronic component;
- attaching the first portion of the clip to the bottom surface of the first fin of the heat sink;
- applying force to the second leg of the clip toward the first leg of the clip to drive a movement of the second portion of the clip against the electronic component.
Dependencies are inferred from the claim text.