Manufacturing method of package structure

A manufacturing method of a package structure, comprising:

• providing a metal substrate, the metal substrate having a first surface, a second surface, and a side surface connecting the first surface and the second surface, the first surface and the second surface being opposite to each other, wherein a seed layer covering the first surface, the second surface, and the side surface is located on the metal substrate;
• forming a patterned circuit layer on a portion of the seed layer located on the first surface of the metal substrate;
• forming a first patterned dry film layer on the other portion of the seed layer located on the first surface of the metal substrate;
• electroplating a surface treatment layer on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask;
• removing the first patterned dry film layer;
• performing a chip bonding process to electrically connect a chip to the surface treatment layer;
• forming an encapsulant on the metal substrate, the encapsulant encapsulating the chip, the surface treatment layer, and the patterned circuit layer;
• and
• removing the metal substrate and the seed layer to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.