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US 8,893,361 B2Granted
Method of bonding components to each other using exothermic reactions
AssigneeThe Boeing Company
InventorFong Shi
Life of this patent
Estimating the term…
Abstract
A method and apparatus for joining a first workpiece and a second workpiece. A layer of exothermic material is placed between the first workpiece and the second workpiece. A plurality of currents is applied to the layer of exothermic material in a plurality of locations and substantially at the same time such that an exothermic reaction occurs in the layer of exothermic material.
Claims20
A method for joining a first workpiece and a second workpiece to each other, the method comprising:
- placing a layer of exothermic material between the first workpiece and the second workpiece, wherein the first workpiece is a cover and the second workpiece comprising a substrate, the cover covering an integrated circuit on the substrate, the substrate and cover forming a package for holding the integrated circuit;
- and
- applying a plurality of currents to the layer of exothermic material in a plurality of locations, wherein the plurality of currents is applied substantially simultaneous such that an exothermic reaction occurs in the layer of exothermic material.
A method for sealing a circuit on a printed circuit board, the method comprising:
- placing a layer of exothermic material between a cover and the printed circuit board, wherein the cover is located over an integrated circuit on the printed circuit board;
- applying a plurality of current pulses to the layer of exothermic material in a plurality of locations, wherein the plurality of current pulses is applied substantially simultaneous such that an exothermic reaction occurs in the layer of exothermic material;
- and
- applying a force that pushes the cover toward the printed circuit board while the exothermic reaction occurs, wherein a hermetic seal is formed between the cover and the printed circuit board.
1 more element
Dependencies are inferred from the claim text.