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US 8,888,085 B2Granted
Devices and methodologies for handling wafers
AssigneeSkyworks Solutions, Inc.
InventorsSteve Canale, David J. Zapp
Life of this patent
Estimating the term…
Abstract
Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed.
Claims20
A wafer holding device, comprising:
- a plate having a top side including a surface and a bottom side spaced from the top side by a thickness, the plate dimensioned to receive a wafer on the top side, the plate including a handling tab positioned at a first end of the plate and extending outward from the first end, a second end of the plate opposite the first end being curved;
- a retaining feature positioned at the second end and having a first extension from the plate and a second extension from the first extension extending over at least a portion of the surface, the first and second extensions defining a recess;
- and
- a plurality of features formed on the surface of the plate, distributed substantially uniformly across an area of at least approximately 100 mm in diameter on the surface, the top side dimensioned such that the wafer positioned on the top side is in contact with and supported by at least some of the features formed on the surface such that the wafer is offset from the surface by a height defined by the plurality of features and positioned over the surface, the recess dimensioned to retain the wafer and accommodate the height.
1 more element
A cassette to hold one or more wafer holding devices, the cassette comprising:
- a frame defining an interior volume;
- and
- a receptacle structured to accept the wafer holding device and hold the wafer holding device within the interior volume of the frame, the receptacle forming a first angle with the horizontal;
- and
- a base including an angled cassette-holding surface selected to counter the first angle with the horizontal and configured to be positioned below the cassette, the cassette configured to be selectively situated in either of a collection orientation and a cleaning orientation, when in the collection orientation, the base being positioned below the cassette and the wafer holding device being held in the cassette approximately horizontally, and when in the cleaning orientation, the receptacle forming the first angle away from the vertical and the wafer holding device being held at the first angle away from the vertical so that the wafer is retained on the plate.
2 more elements
A cassette to hold one or more wafer holding devices, the cassette comprising:
- a frame defining an interior volume;
- a plurality of receptacles structured to accept corresponding ones of the wafer holding devices and hold the ones of the wafer holding devices in the interior volume, each receptacle including a first bar extending along a first side of the frame from a loading side of the frame to a back side of the frame opposite the loading side and a second bar extending along a second side of the frame opposite the first side from the loading side to the back side, the first bar opposite the second bar, the first and second bars forming a slot configured to accept the wafer holding device, the first and second bars angled inward such that a distance between first ends of the first and second bars at the loading side is greater than a distance between second ends of the first and second bars at the back side;
- and
- a top cover supported by the frame and disposed above a location where an uppermost wafer holding device is held, the top cover dimensioned to provide a cover for a wafer on the uppermost wafer holding device to provide the uppermost wafer with a similar plasma cleaning environment as at least another wafer held underneath, the frame being open for ingress of a cleaning plasma into the cassette, and the receptacles configured so the wafer holding device is held in the frame approximately horizontally to allow plasma cleaning of a wafer held on the wafer holding device.
1 more element
Dependencies are inferred from the claim text.