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US 8,884,438 B2Granted
Magnetic microinductors for integrated circuit packaging
AssigneeIntel Corporation
InventorsDonald S. Gardner, Larry E. Mosley
Life of this patent
Estimating the term…
Abstract
Magnetic microinductors formed on semiconductor packages are provided. The magnetic microinductors are formed as one or more layers of coplanar magnetic material on a package substrate. Conducting vias extend perpendicularly through the plane of the magnetic film. The magnetic film is a layer of isotropic magnetic material or a plurality of layers of anisotropic magnetic material having differing hard axes of magnetization.
Claims35
A device comprising,
- a substrate having a surface,
- a magnetic film disposed on the substrate surface wherein the magnetic film has non-linear-magnetic properties, and
- a plurality of conducting vias extending perpendicularly through the magnetic film that has non-linear magnetic properties wherein the plurality of conducting vias extend from a first face of the magnetic film that has non-linear magnetic properties to a second face of the magnetic film that has non-linear magnetic properties.
A method for forming a device comprising,
- providing a package substrate having a surface,
- depositing a magnetic film on the package substrate surface wherein the magnetic film has non-linear-magnetic properties,
- forming a plurality of conducting vias in the semiconductor package substrate,
- so that in the resulting device the direction of current flow in the conducting vias is perpendicular to the plane of the non-linear magnetic film and the conducting vias extend through the magnetic film wherein the plurality of conducting vias extend from a first face of the magnetic film that has non-linear magnetic properties to a second face of the magnetic film that has non-linear magnetic properties.
1 more element
A device comprising,
- a packaging substrate having a surface,
- a first anisotropic magnetic film disposed on the substrate surface,
- a second anisotropic magnetic film disposed on the substrate surface wherein the second anisotropic magnetic film is co-located with the first anisotropic magnetic film and wherein the first anisotropic magnetic film is at least 1.5 times as thick as the second anisotropic magnetic film, and
- a plurality of conducting vias extending perpendicularly through the anisotropic magnetic film.
1 more element
A device comprising,
- a packaging substrate having a surface,
- a first anisotropic magnetic film disposed on the substrate surface,
- a second anisotropic magnetic film disposed on the substrate surface wherein the second anisotropic magnetic film is co-located with the first anisotropic magnetic film and wherein the first anisotropic magnetic film is at least 1.5 times as thick as the second anisotropic magnetic film, and
- an elongated conducting via extending perpendicularly through the anisotropic magnetic film wherein the conducting via is extended in a first dimension that is parallel to the plane of the magnetic film relative to a second dimension that is also parallel to the plane of the magnetic film.
1 more element
A device comprising,
- a packaging substrate having a surface,
- at least one non-linear magnetic film disposed on the substrate surface,
- a plurality of conducting vias extending perpendicularly through the non-linear magnetic film, and
- a spiral conducting wire structure disposed on the substrate wherein a dimension of the spiral conducting wire structure at least partially overlaps with a dimension of the non-linear magnetic film wherein the plurality of conducting vias form part of the spiral conducting wire.
1 more element
Dependencies are inferred from the claim text.