Method for forming pattern
AssigneeJsr Corporation
InventorsGoji Wakamatsu, Hayato Namai, Syun Aoki
Life of this patent
Estimating the term…
Loading patent…
AssigneeJsr Corporation
InventorsGoji Wakamatsu, Hayato Namai, Syun Aoki
Estimating the term…
A method for forming a pattern includes providing a composition to form a resist underlayer film on a surface of a substrate to be processed. The composition contains a calixarene based compound having a group represented by a following formula (i) bound to at least a part of an aromatic ring or at least a part of a heteroaromatic ring of the calixarene based compound. The resist underlayer film on the surface of the substrate is treated with heat or an acid. A resist pattern is formed on a surface of the resist underlayer film. The resist underlayer film and the substrate are etched using the resist pattern as a mask to form the pattern on the substrate. The dry-etched resist underlayer film is removed from the substrate with a basic solution. —O—R1 (i)
A method for forming a pattern comprising the steps in the following order of:
Dependencies are inferred from the claim text.