Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body

A process for manufacturing a laminated body, comprising the steps of:

• providing a first resin layer including a first fibrous base material and a resin and a second resin layer including a second fibrous base material and a resin;
• disposing said first resin layer and said second resin layer such that at least a part of said first resin layer and at least a part of said second resin layer are positioned in separate regions separated by the center line in a thickness direction of said laminated body;
• laminating said first resin layer and said second resin layer directly or via another layer;
• and
• heating and pressing said first resin layer and said second resin layer to form a laminated body,
• wherein each of said first fibrous base material and said second fibrous base material has a bowing region, where the bowing region is a region in which a smaller warp/weft crossing angle is less than 89° in said first and second fibrous base materials;
• wherein in the step of laminating said first resin layer and said second resin layer, said first fibrous base material and said second fibrous base material are disposed such that the bowing regions of said first fibrous base material and said second fibrous base material overlap, and said first resin layer and said second resin layer are laminated such that in said bowing region, the larger angle among an angle formed by a warp of said first fibrous base material and a warp of said second fibrous base material and an angle formed by a weft of said first fibrous base material and a weft of said second fibrous base material is 2° or less.