Negative-type photosensitive resin composition, pattern forming method and electronic parts
AssigneeHitachi Chemical Dupont Microsystems, Ltd.
InventorTomonori Minegishi
Life of this patent
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Abstract
A negative-type photosensitive resin composition which is good in sensitivity and resolution, a pattern forming method by the use thereof wherein a pattern which can be developed in an alkali aqueous solution, is excellent in sensitivity, resolution and heat resistance and has a good shape is obtained, and highly reliable electronic parts are provided. The negative-type photosensitive rein composition includes (a) a polymer that has a phenolic hydroxyl group at a terminal and is soluble in the alkali aqueous solution, (b) a compound that generates an acid by irradiating active light, and (c) a compound that can be crosslinked or polymerized by an action of the acid.
Claims10
A photosensitive resin composition comprising:
- (a) a polymer that has a phenolic hydroxyl group at a terminal thereof and is soluble in an alkali aqueous solution, wherein the phenolic hydroxyl group is at a meta-position with respect to a binding site of the phenolic group, and wherein the polymer comprises at least one heat-resistant polymer compound selected from the group consisting of polyimide, polyoxazole, polyamideimide, polyamide, polyamic acid, polyamic acid ester and polyhydroxyamide;
- (b) a second compound that generates an acid by irradiating active light, wherein the second compound is selected from the group consisting of compounds represented by one of the following formulas B1 and B2,
- (c) a third compound that can be crosslinked or polymerized by an action of the acid, wherein the third compound represented by the general formula (II),
- wherein two Y each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, an oxygen atom or a fluorine atom;
- R3 and R4 each independently represent a hydrogen atom;
- R5 and R6 each independently represent a hydrogen atom or a monovalent organic group;
- m and g each independently represent integers of 1 to 3;
- and e and f each independently represent integers of 0 to 4;
- or the third compound is a compound represented by the general formula (III),
- wherein multiple R7 and R8 each independently represent a hydrogen atom or a monovalent organic group, and
- wherein the photosensitive resin composition is a negative-type photosensitive resin composition.
A photosensitive resin composition comprising:
- (a) a polymer that has a phenolic hydroxyl group at a terminal thereof and soluble in an alkali aqueous solution, wherein the phenolic hydroxyl group is at a meta-position with respect to a binding site of the phenolic group, and wherein the polymer comprises at least one heat-resistant polymer compound selected from the group consisting of polymide, polyoxazole, polyamideimide, polyamide, polyamic acid, polyamic acid ester and polyhydroxyamide;
- (b) a second compound that generates an acid by irradiating active light, wherein the second compound is selected from the group consisting of compounds represented by one of the following formulas B1 and B2,
- (c) a third compound that can be crosslinked or polymerized by an action of the acid, wherein the third compound is a compound represented by the general formula (II),
- wherein two Y each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, an oxygen atom or a fluorine atom;
- R3 and R4 each independently represent a hydrogen atom;
- R5 and R6 each independently represent a hydrogen atom or a monovalent organic group;
- m and g each independently represent integers of 1 to 3;
- and e and f each independently represent integers of 0 to 4;
- or the third compound is a compound represented b the general formula (III),
- wherein multiple R7 and R8 each independently represent a hydrogen atom or a monovalent, organic group, and
- wherein the photosensitive resin composition is a negative-type photosensitive resin composition, wherein once the photosensitive resin composition is cured, the cured composition has a glass transition temperature of 266° C. to 286° C., a 5% weight loss temperature of 464° C. to 473° C., and a braking elongation of 14% to 22%.
Dependencies are inferred from the claim text.