Copper-based sliding material
AssigneeDaido Metal Company Ltd.
InventorsTakuo Imai, Kouji Zusi, Kentaro Tujimoto
Life of this patent
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Abstract
Provided is a copper-based sliding material including a steel back-metal layer and a Cu alloy layer. The Cu alloy layer contains, by mass %, 10 to 30% of Bi, 0.5 to 5% of an inorganic compound, and the balance being Cu and inevitable impurities. The Cu alloy layer may further contain 0.5 to 5% of Sn and/or at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%. The inorganic compound has an average particle size of 1 to 5 μm and a specific gravity of 70 to 130% relative to the specific gravity of Bi. Bi phase is formed in the Cu alloy layer in an average particle size of 2 to 15 μm, and the Bi phase is dispersed in the Cu alloy layer and isotropic.
Claims4
A copper-based sliding material comprising
- a steel back-metal layer and a Cu alloy layer, the Cu alloy layer consisting of, by mass %,
- greater than 10 to 30% of Bi particles,
- 0.5 to 5% of particles of an inorganic compound,
- optionally 0.5 to 5% of Sn,
- optionally at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%, and
- the balance being Cu and inevitable impurities,
- wherein the inorganic compound has an average particle size of 1 to 5 μm and a specific gravity of 70 to 130% relative to the specific gravity of Bi, and
- wherein the Bi particles are in the Cu alloy layer in an average particle size of 2 to 15 μm, and the Bi phase is dispersed in the Cu alloy layer and isotropic
- wherein an average value of x/y is 1 to 2 where x is an average length of the Bi particles in a x-axis direction and y is an average length of the Bi particles in a y-axis direction where the x-axis is taken in a thickness direction of the Cu alloy layer and the y-axis is perpendicular to the x-axis.
A copper-based sliding material comprising a steel back-metal layer and a Cu alloy layer, the Cu alloy layer consisting of, by mass %,
- greater than 10 to 30% of Bi particles,
- 0.5 to 5% of particles of an inorganic compound,
- optionally 0.5 to 5% of Sn,
- optionally at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%, and
- the balance being Cu and inevitable impurities,
- wherein the inorganic compound has an average particle size of 1 to 5 μm and a specific gravity of 70 to 130% relative to the specific gravity of Bi, and
- wherein the Bi particles are in the Cu alloy layer in an average particle size of 2 to 15 μm, and the Bi phase is dispersed in the Cu alloy layer and isotropic
- wherein an average value of x/y is 1 to 2 where x is an average length of the Bi particles in a x-axis direction and y is an average length of the Bi particles in a y-axis direction where the x-axis is taken in a thickness direction of the Cu alloy layer and the y-axis is perpendicular to the x-axis;
- wherein the inorganic compound has a specific gravity of 90 to 110% relative to the specific gravity of Bi;
- and
- wherein the inorganic compound is a carbide, nitride or silicide of a metal.
Dependencies are inferred from the claim text.