Device containing plurality of smaller MEMS devices in place of a larger MEMS device

A device structure, comprising:

• a substrate;
• a plurality of layers formed over the substrate, a first layer of the plurality of layers bounding one or more cavities formed within the structure between the substrate and the plurality of layers;
• a plurality of micro electromechanical devices disposed over the substrate and within each of the one or more cavities;
• a pull up electrode within at least one of the one or more cavities and coupled with the first layer above the plurality of micro electromechanical devices;
• a via connection from the substrate to one or more layers disposed over the one or more cavities;
• a first electrode;
• a second electrode;
• and
• a plurality of cantilevers that are each movable from a position in contact with the first electrode to a position spaced from both the first electrode and the second electrode to a position in contact with the second electrode.

A device structure, comprising:

• a substrate;
• a layer formed over the substrate and bounding a cavity formed within the structure;
• a plurality of micro electromechanical devices disposed within the cavity;
• a pull up electrode within the cavity and coupled with the layer;
• a via connection from the substrate to layer;
• a first electrode;
• a second electrode;
• and
• a plurality of cantilevers that are each movable from a position in contact with the first electrode to a position spaced from both the first electrode and the second electrode to a position in contact with the second electrode, wherein:
• the cavity has a length, a width and a height where at least one of the length or width is between about 20 microns and about 30 microns;
• the cavity and plurality of micro electromechanical devices are embedded within a complementary metal oxide semiconductor;
• and
• a first device of the plurality of devices has a different design than a second device of the plurality of devices.

A device structure, comprising:

• a substrate;
• a layer formed over the substrate and bounding a cavity formed within the structure;
• a plurality of micro electromechanical devices disposed within the cavity;
• a pull up electrode within the cavity and coupled with the layer;
• a via connection from the substrate to layer;
• a first electrode;
• a second electrode;
• and
• a plurality of cantilevers that are each movable from a position in contact with the first electrode to a position spaced from both the first electrode and the second electrode to a position in contact with the second electrode.