US 8,855,581 B2 · Integrated circuit package with transformer

Abstract

Aspects of a method and system for a transformer in an integrated circuit package are provided. In this regard, signals may be transmitted and/or received via an antenna communicatively coupled to a transformer embedded in multi-layer integrated circuit package. The windings ratio of the transformer may be configured based on an impedance of the antenna, an impedance of a transmitter coupled to the transformer, an impedance of an LNA coupled to the transformer, and/or a power level of the received and/or transmitted signals. The windings ratio may be configured via one or more switching elements which may be MEMS switches embedded in the multi-layer IC package. The transformer may comprise a plurality of loops fabricated on a corresponding plurality of metal layers in the multi-layer IC package, and the loops may be communicatively coupled with one or more vias. The multi-layer IC package may comprise ferromagnetic and/or ferromagnetic materials.

Claims18

Dependent claims

An integrated circuit package comprising:

a transformer;
one or more switching elements;
said transformer enabling transmitting and/or receiving signals;
said one or more switching elements enabling configuring a windings ratio of said transformer based on an impedance of a transmitter coupled to said transformer;
and
said transformer and said one or more switching elements being embedded in said integrated circuit package.

3 more elements

Dependencies are inferred from the claim text.

Integrated circuit package with transformer

Life of this patent

Integrated circuit package with transformer

Life of this patent

Abstract

Claims18