Adhesion enhancement of thin film PZT structure
AssigneeSeagate Technology LLC
InventorsDadi Setiadi, Wei Tian, Young Pil Kim
Life of this patent
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Abstract
A microactuator, for example for a disc drive, comprising a substrate, a sandwich structure on the substrate, and a passivation layer over the substrate and the sandwich structure. The sandwich structure has a bottom electrode formed from noble metal, a piezoelectric layer, and a top electrode formed from noble metal. The microactuator further has one or both of a bottom adhesion layer present between the bottom electrode and the passivation layer, and a top adhesion layer present between the top electrode and the passivation layer. That is, the microactuator may have only the bottom adhesion layer, only the top adhesion layer, or both the bottom adhesion layer and the top adhesion layer.
Claims20
A microactuator comprising:
- a substrate;
- a sandwich structure on the substrate, the sandwich structure consisting of a bottom electrode comprising a noble metal, a piezoelectric layer, and a top electrode comprising a noble metal;
- and
- a passivation layer over the substrate and the sandwich structure;
- the microactuator further comprising one or both of:
- a bottom adhesion layer present between the bottom electrode and the passivation layer;
- and
- a top adhesion layer present between the top electrode and the passivation layer.
A microactuator comprising:
- a silicon substrate;
- a bottom electrode on the substrate;
- a piezoelectric layer on and in contact with a first section of the bottom electrode;
- a top electrode on and in contact with the piezoelectric layer;
- a bottom adhesion layer on a second section of the bottom electrode;
- a top adhesion layer on the top electrode;
- and
- a passivation layer over the bottom adhesion layer and the top adhesion layer.
A disc drive comprising a microactuator, a suspension assembly, and a head gimbal assembly;
- the microactuator comprising a silicon substrate, a bottom electrode comprising one of platinum, iridium, ruthenium, or rhodium on the substrate, a piezoelectric layer on and in contact with a first section of the bottom electrode, a top electrode comprising one of platinum, iridium, ruthenium, or rhodium, on and in contact with the piezoelectric layer, a bottom adhesion layer on a second section of the bottom electrode, a top adhesion layer on the top electrode, and a dielectric passivation layer over the bottom adhesion layer and the top adhesion layer.
Dependencies are inferred from the claim text.